Packaging: Military Specification related categories
Desi-Pak® Type I & II Desi-Pak® is a dimensionally stable, chemically inert, aluminum silcate clay packaged in non-dusting, air permeable bags. The internal structure of this clay is a network of microscopic pores that attract and hold water through physical adsorption. Desi-Pak® remains dry and will not soften or liquefy even at full water saturation. It is non-corrosive and can be placed in direct contact with metal parts.
APPLICATION
Desi-Pak® is a cost efficient desiccant that will protect the contents of a sealed container until it is opened. The contents of a sealed container will remain free from mildew or corrosion and will be in the same condition as when packaged for shipment or storage.
DUSTING Desi-Pak® is packaged in tear resistant, dustproof bags.
PERFORMANCE Desi-Pak® exceeds the requirements of MIL-D-3464D in actual performance. It exceeds the water adsorption of Silica Gel at various humidity levels. Placed within a sealed package or container to protect goods/products from moisture damage. Used with electronic parts, aerospace missile components, computer components or any environment that is sensitive to dust. Desi-Pak® is used by both general purpose and non-dusting purposes. Meets military specification MIL-D-3464E.
Note: Each container of Desi-Pak® includes an MS26507-1 humidity indicator card to insure that the desiccant is active when recieved.
Desi-Pak Tyvek® Tyvek® Bags Tyvek is made from a spunbonded olefin. Tyvek bags are made from high density polyethylene fibers, making them extremely tear-resistant. In addition, Tyvek is lightweight, flexible, smooth, low-linting, and is resistant to water, chemical abrasion, and aging. Desi-Pak® is a dimensionally stable, chemically inert, aluminum silcate clay packaged in non-dusting, air permeable bags. The internal structure of this clay is a network of microscopic pores that attract and hold water through physical adsorption. Desi-Pak® remains dry and will not soften or liquefy even at full water saturation. It is non-corrosive and can be placed in direct contact with metal parts. The Desi-Pak® Tyvek® bag is approved for use in a Class 100 Clean Room environment. Exceeds requirement of MIL-D-3464D
APPLICATION
Used with electronic parts, aerospace missile components, computer components, optical devices, laser equipment or any environment that is sensitive to dust.
Note: Each container of Desi-Pak® Tyvek® includes an MS26507-1 humidity indicator card to insure that the desiccant is active when received.