Meets requirements of MIL-STD-883C Methods 2011 and 2023, and MIL-STD-1772
As fast as one test per second with programmed printout
0.5 to 1000 gram-force range with interchangeable beams
Available with fixed and rotatable hook beams
Semiautomatic operation increases throughput
Holders for most devices
According to industry statistics, insufficient bond strength is a major cause of device failure. Bond pull tests are routinely used to evaluate and/or control the mechanical strength of wire bonds in microcircuit devices. The Miyachi Unitek Micropull IV (MP4) is a semi-automatic machine designed to perform wire bond pull tests in the 0.5 to 1000 gram force range. It can automatically detect wire bond failures occurring during the test, as well as excessive wire bond loop height.
To perform a wire bond test, the operator need only position the hook directly under the midpoint of each wire bond. The hook is then raised until the bond is stressed to a predetermined value (non-destructive pull test-NDPT), or the wire breaks (destructive pull test-DPT). The MP4 displays the results and outputs them via an RS-232 type serial interface. Using three interchangeable beams, the MP4 may perform these tests at rates of up to one test per second..
The intent of the NDPT is to use a force great enough to cause weak bonds to fail, yet insufficient to damage good bonds. Recommended values for the maximum safe forces for NDPT may be found in MIL-STD-883, Method 2023. MIL-STD-883 Method 2001 covers DPT. The MP4 complies fully with and performs wire pull tests that meet the requirements of MIL-STD-883..
The accuracy of the MP4 system is ±2% of reading or ±2 gf, whichever is greater..
The MP4 software keeps track of the test number, device number and pull strength. At the conclusion of each test, the MP4 software displays and prints summary statistical data for the device and histogram information for the device or group of devices.
Data Logging Software, Printer and Keyboard Software Included
Meets Requirements of MIL-STD-883F Methods 2011 and 2023, and MIL-STD-1772
Destructive and Non-Destructive Testing
0.9 to 99.9 Gram Force Range
According to industry statistics, insufficient bond strength is a major cause of device failure. Bond pull tests are routinely used to evaluate and/or control the mechanical strength of wire bonds in microcircuit devices. The Micropull V (MP5) is a manual machine designed to perform wire bond pull tests in the 0.9 to 99.9 gf range in accordance with MIL-STD-883C and MIL-STD-1772. The simple mechanical operation has been shown to be fast and efficient in production line applications.
The MP5 adds data logging to the time-tested Micropull design, resultant of extensive work with the National Bureau of Standards, while maintaining the affordability of the earlier version Micropull. The MP5 will perform either destructive or non-destructive pull tests and display and print the results.
The bond pull test is performed by placing the microelectronic device in an appropriate holder and positioning a hook under the wire midway between the two bonds. The hook is then raised until the bond is stressed to a predetermined value (non-destructive pull test, NDPT) or the wire bond breaks (destructive pull test).
The intent of the NDPT is to use a force great enough to cause weak bonds to fail, yet insufficient to damage good bonds. Recommended values for the maximum safe forces for NDPT may be found in MIL-STD-883, Method 2011 and 2023.
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