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Home > Supplier - Product/Service Results: Bonding Resins

Narrow Your Search Search Within Results Locations Served Pennsylvania - East Cities Essington Exton Montgomeryville Search Within # Miles Show companies within miles of: Company Type Manufacturers Custom Manufacturers Certifications ISO 9000:2001 ISO 9001 Any Certification Product Detail Product Catalogs Expand Your Search Related Categories Abrasive Bonding Resins Resins Bonding Tapes Bonding Compounds Adhesive Bonding Bonding Machinery Rubber-to-Plastic Bonding Bonding Wire Bonding Agents Bonding Ovens Bonding Tools Bonding Clamps Bonding Primers Welding Services Epoxy Resins More... Provide Feedback

Bonding Resins Suppliers serving Eastern Pennsylvania Displaying 1 to 3 out of 3 results to Sartomer USA, LLC - Exton, PA Manufacturer, Custom Manufacturer ISO 9001 certified. Global supplier of monomers, oligomers & other resins used for ultraviolet & electron beam, light cured, peroxide & two-part epoxy/amine curing applications. Brand Names: M Cure www.sartomer.com/prod.asp Esstech, Inc. - Essington, PA Manufacturer, Custom Manufacturer Manufacturer of monomers with low color & acid in addition to the appropriate inhibitors, viscosity & refractive index values. UDMA, extended UDMA, BisGMA, Ethoxylated BisPhenol-A-DMA with varying ethoxylation levels, IPDMA. catalog.esstechinc.com/category/resins? Bonding Resins Product Catalog: BisGMA/Triethyleneglycol Dimethacrylate (80/20) BisGMA/ Triethyleneglycol Dimethacrylate (50/50) Ethoxylated Bis Phenol A Dimethacrylate More Info ITW Polymer Technologies, Insulcast Div. - Montgomeryville, PA Manufacturer Manufacturer of thermally conductive & electronic resins for encapsulation. Resins are designed to protect components in heat sink bonding, surface mount & die attach applications. Resins available include enhanced thermal conductive, low stress & low coefficient of thermal expansion, UL recognized for flame class 94V-0, thermal shock resistant, conformal & dip coating, low density & room temperature curing resins. Electrical specifications include dielectric strength 455 V per mil with dielectric constant 4.2 at 1 kHz., dissipation factor 0.026 at 1 kHz. & volume resistivity 2 quadrillion ohm-cm. Physical specifications include hardness 85 durometer, tensile strength 12,000 psi, tensile elongation 3 percent, compressive strength 16000 psi, flexural strength 18000 psi & coefficient of thermal expansion 0.000075. Resins are ideal for protecting components in heat sink bonding, surface mount & die attach applications. to

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