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Die Attached Adhesives Suppliers

Displaying 1 to 6 out of 6 results
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Indium Corporation - Clinton, NY
Distributor, Manufacturer, Custom Manufacturer
ISO 9001:2008 certified manufacturer & distributor of die attached materials including electrically & thermally conductive adhesives. Designed for use with high-throughput or high-mix, low volume in-line curing ovens. Adhesives are premixed, air-free, single part epoxy die attach adhesive, filled with pure silver. Applications include printing & dispensing.
Master Bond, Inc. - Hackensack, NJ
Manufacturer, Custom Manufacturer, Service Company
Manufacturer of die-attach adhesive, underfill adhesive, encapsulants & electrical potting compounds for the microelectronics industry. Full application engineering & technical support provided. Die attach compounds & flip-chip adhesives feature high thermal conductivity, electrical insulation, volume resistivity, dielectric strength, low dielectric constants & dissipation factors low thermal expansion coefficients. Packaging is optimized for die-attach processes.
Epoxyset, Inc. - Lincoln, RI
Custom Manufacturer
ISO 9001:2008 certified. Custom manufacturer of die attached & low ionic content adhesives for chip bonding & cold-soldering applications. Specifications include viscosity greater than 250,000 cps, die shear strength greater than 3,500 psi, service temperature up to 250 degrees C & thermal conductivity up to 4.2 W/m degrees K. Adhesives are suitable for electronic & microelectronic, medical, semiconductor, fiber optics & aerospace industries. RoHS compliant.
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Epoxy Technology, Inc. - Billerica, MA
Manufacturer
ISO 9001:2008 certified manufacturer of adhesives for die attached applications. Available in single-component formulation as electrically conductive, thermally conductive, thixotropic, snap cure & silver filled adhesives. Meet MIL-STD 883/5011. RoHS compliant.
Electronic Materials, Inc. - Breckenridge, CO
Manufacturer
ISO 9001 certified manufacturer of die attach adhesives. Low shrinkage, clear & core, single & double component, UV & thermal cure, thermally conductive, electrically conductive & surface mount adhesives are also available. Adhesives are suitable for circuit board, photonic, fiber optic, electronic, medial, disposable bonding & general applications.
S-Bond Technologies, LLC - Lansdale, PA
Manufacturer, Custom Manufacturer, Service Company
Producer of fluxless solders used to join metals, ceramics, glasses & graphite in air & at low temperatures. Replaces conventional flux solders, brazes & adhesives, allowing higher strength, simple processing & better thermal conductivity.
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