Fiber Wafer Dicing Services

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Fiber Wafer Dicing Services Suppliers

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THINFILMS, Inc. - Hillsborough, NJ
Custom Manufacturer, Service Company
ISO 9001:2000 certified. Thin film circuit fabrication services including dicing on ceramic substrates & Si wafers with plus/minus one mil tolerance. Other thin film circuit fabrication services: photo-lithography, ion milling, wet & reactive ion etching.
Kleir International - Castle Rock, CO
Custom Manufacturer
Fiber wafer dicing services. Specializing in contract diamond wire slicing of high value materials such as grown crystals, silicon and ceramics for use in many different industries. The diamond wire slicing process provides less kerf loss with outstanding finishes to micron level tolerances. Lead times are short and can accommodate requirements from R&D to production quantities.
Ion Beam Milling, Inc. - Manchester, NH
Manufacturer, Service Company
ISO 9001:2000 certified dicing services of materials including alumina, beryllium oxide, quartz, aluminum nitride, & silicon in various thicknesses. Dicing services feature burr & chip free cuts. Trench cuts in substrates of various sizes & shapes are also available. Other services include ion beam etching, photolithography/photo pattern processing, testing & measurement, & wafer processing. Equipped with a thin diamond blade mounted on a high speed air bearing spindle. Applications include commercial, industrial, military, & satellite. Markets served include microelectronics & microwave.
Thin Film Technology, Inc. - Buellton, CA
Manufacturer, Custom Manufacturer, Service Company
Metallic & Dielectric Thin Film Vacuum Deposition Coating Services By Sputtering Or Electron Beam Evaporation
Pelican Packaging,Inc - Carlsbad, CA
Service Company
Semiconductor Services Including Wafer Processing, Wafer Dicing, Wafer Cleaning, And Packaging.
ELume Inc. - Oxnard, CA
Manufacturer, Custom Manufacturer, Service Company
ISO-9000 compliant. Silicon and glass wafer dicing services. Additional materials include aluminum, sapphire, silicon carbide, lithium niobate and flexible polymer substrates withstanding 450 degrees Celsius. Capabilities include sputtering, wet/dry and thermal oxidation, spin-on diffusion, multi-level metallization, glass mask development, wet and dry etching, wafer scribing and thinning, wire bonding and die packaging. Industries served include research and development, education and business.
American Precision Dicing, Inc. - San Jose, CA
Service Company
Quick turn custom dicing of silicon wafers for the semiconductor industry.
Precision Surface Technology - Allentown, PA
Manufacturer, Custom Manufacturer, Service Company
Service company offering dicing, polishing, & sputtering of wafers for the semi-conductor & sensor industries. Process capabilities include bevel cutting, burr free dicing, chip free dicing, cleaning & packaging, die singulation, fiber optic polishing, isolation cutting, plated thru holes, substrate edge chamfering, substrate grooving & slotting, thin film resistors, wafer dicing, wafer scribing, wrap around metallization.
Syagrus Systems - Arden Hills, MN
Service Company
Fiber wafter dicing services. Capabilities include .250" to 8" flexible dicing, singulated devices as small as .010", wafers as thin as .002", bumped and non-bumped wafer dicing, surfactants and prototypes such as multi die wafers.
TeraXion Inc. - Quebec, QC
Manufacturer, Custom Manufacturer, Service Company
Dicing service for photonics, medical, electronics, & other application fields; dicing of glass, ceramic, or semi-conductor materials; prototypes or small production runs; clean room environment; 0.001mm precision; programmable CNC workstation.
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