Spectrum Process Equipment, Inc. - Wernersville, PA
Distributor
Distributor of surplus, used & refurbished wafer dicing equipment including semiautomatic wafer dicing saws. Available in 240 mm X-axis (feed), 165 mm Y-axis (index), index step from 0.02 mm to 99.999 mm, rotation angles from 0.01 degrees to 165 degrees & spindle speeds from 15,000 rpm to 50,000 rpm. Wafer dicing saws can be used for dicing wafers in dia. from 25.4 mm to 152.4 mm & thicknesses from 0.01 mm to 5 mm.
www.1spectrum.com/searchresults.asp?cat=61

GSI Group-Precision Motion Division - Bedford, MA
Manufacturer, Custom Manufacturer
ISO 9001:2000 certified manufacturer of standard & custom wafer processing systems including wafer dicing & splicing equipment & systems. Features include rear or side mount service connectors, flange or body mounting, twin removable brush assemblies & ultra low vibration. Specifications include normal blade size from 50 mm to 100 mm, maximum speed of 60,000 rpm, bearing air pressure up to 80 psig, cooling water flow rate up to 2.1 liters per minute. Services include application consulting, CAD/CAM, technical consultation, OEM design support & rapid prototyping. Markets served include aerospace, automotive, energy, electronics, medical, pharmaceuticals & consumer goods industries.

GTI Technologies, Inc. - Shelton, CT
Distributor, Manufacturer, Service Company
GTI-Moore dual spindle high speed dicing saw for hard materials; JFP microtechnic scribe & break systems; Takatori multi-wire saws for wide varieties of hard & fragile semiconductor & electronics substrates.

Giorgio Technology Sales / Service - Mesa, AZ
Distributor, Service Company
Specializes in refurbishing & distribution of dicing saws, wafer backgrinders, wafer mounters, wafer washers & UV exposure tools. Dist of refurbished assembly equipment, used assembly equipment & materials for semiconductor assembly, packaging, medical & electronics industries.

Moore Tool Company - Bridgeport, CT
Distributor, Manufacturer, Custom Manufacturer, Service Company
Worldwide manufacturer of machining centers & equipment including wafer dicing & slicing systems available as dual spindle machines for grinding wafers from 2 in. to 6 in. dia. Machining centers feature 2 independently controlled spindles, one for the roughing operation & one for the finishing operation to pick the optimal wheel roughness for both material removal & overall surface finish. Also available in dual spindle-dicing machining centers with 25,000 rpm spindles for climb cutting in both directions with cutting speeds of up to 30 in./second with clean cut part edges. X & Y axes use ball screw drive & roller ways.