
Master Bond, Inc.
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http://masterbond.rtrk.com/?scid=774266&rl_alt=http%3A%2F%2Fwww.masterbond....
154 Hobart St.
Hackensack, NJ 07601-3950
Phone: 201-343-8983, 866-213-7652 (toll free) Fax: 201-243-2132
Manufacturer of a comprehensive line of engineered adhesives, coatings, sealants, potting compounds, encapsulation compounds, impregnating resins & encapsulants. Application engineering & full technical support provided. Industrial & custom UV curing adhesives, structural epoxy adhesives, polyurethane, silicon, rubber adhesives, acrylic, hot melt adhesives, instant cyanoacrylate, contact adhesives, films & performs & pressure sensitive adhesives. Special purpose adhesives & coatings for industries including OEM aerospace, electronic, microelectronic, automotive, telecommunications, medical, optical, photonics, underfill, chip bonding, PCB & surface mount adhesives. New & custom, environmentally responsible formulations include advanced epoxy heat resistant adhesives, electrically conductive, thermally conductive adhesives, permanent & removable adhesives, rework, eco-safe, low V.O.C. & medically approved adhesives. Meets ASTM, USP Class VI, NASA, FDA & UL94 V-0.
E-mail Master Bond, Inc.
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Employees: 10-49
Activities: Manufacturer, Custom Manufacturer, Service Company
Export Markets: Middle East, Asia, Europe
News & Press Releases
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November 3, 2009 —
UV Curable Compound with Superior Gap Filling Properties
HACKENSACK, NJ - Oct 29, 2009 - Master Bond UV10TK40 is a UV curable, no-mix epoxy resin system with exceptional sealing and gap-filling properties. It excels in applications such as aligning parts and bonding irregularly shaped surfaces, especially in production environments where increased speed and reduced waste are paramount. Its very high surface hardness (Shore A >75) also makes it an excellent choice for clear coating.
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October 30, 2009 —
Compound's Working Life Beats Conventional Potting Epoxies
Hackensack, NJ. October 27, 2009-Master Bond's newly developed EP29LP-1 epoxy is an attractive potting compound for use in large potting and encapsulating applications. Presenting a gamut of significant potting properties, good compound flow, easy set up and convenient handling, it exhibits a remarkably low exotherm, maximum pot life and desired electrical insulative qualities . The very long working life at ambient temperatures exceeds 6 hours and qualifies this compound for filament winding...
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October 29, 2009 —
Low Shrinkage Clear Epoxy Assures Precision
Master Bond's newly developed EP30LV-1 is a low viscosity, optically clear epoxy offering excellent dimensional stability and low shrinkage. The two part epoxy compound is formulated to cure at room temperatures with an exceptionally low linear shrinkage (0.0003 inches/in). Master Bond EP30LV-1 forms powerful bonds with both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. These high strength and rigid bonds are remarkably...
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October 14, 2009 —
Epoxy for High Temperature Service up to 600°F
HACKENSACK, NJ - Oct 8, 2009 - Developed after years of research, Master Bond EP46HT-1 extends the limits of epoxy adhesive/sealant formulations. It has a continuous service operating temperature range of -100°F to +550°F and can withstand intermittent exposures up to 600°F. EP46HT-1 has a glass transition temperature of over 235°C. In addition to high temperatures, it is also designed to withstand severe and repeated thermal cycling.
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October 5, 2009 —
Advanced Thermal Adhesive Film Assures Reliable Electronic Component Operation
Master Bond has introduced a thermal adhesive film called FL901AO. It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. The 100% solid, B-stage adhesive-preform provides a high bond strength, no-mess solution to electronic assembly and other industrial bonding and sealing operations. An attractive characteristic of the FL901AO epoxy preform is its ability to cure quickly at quite moderate temperatures,...
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October 2, 2009 —
Thermally Conductive Epoxy Film Offers Enhanced Electrically Insulating Performance
Hackensack, NJ, September 30, 2009 - Master Bond has introduced a thermal adhesive film called FL901AO. It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. The 100% solid, B-stage adhesive-preform provides a high bond strength, no-mess solution to electronic assembly and other industrial bonding and sealing operations. An attractive characteristic of the FL901AO epoxy preform is its ability to cure...
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September 16, 2009 —
Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
HACKENSACK, NJ - Sept 10, 2009 - Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated temperatures. It can be cured in various cross section thicknesses.
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September 9, 2009 —
PCB Conformal Coating Features Fast Tack Free Cure
Hackensack, NJ, August 31, 2009 - Moisture-curing silicone conformal coatings are ideally suited as protective coatings for sensitive board components in demanding environments. However, electronic manufacturers avoided the use of silicone coatings in electronic packaging due to their long cure schedule that did not allow rapid assembly.
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August 3, 2009 —
Thermally Conductive Two Part Adhesive for Optimized Heat Dissipation
Hackensack, NJ. July 28 2009-Master Bond's EP30BN is a two part boron nitride epoxy adhesive offering improved thermal management of heat generating components. EP30BN is a medium viscosity epoxy system with good flow characteristics, making it an ideal thermally conductive adhesive for bonding, sealing and potting applications. Featuring remarkably high thermal conductivity and excellent electrical insulation properties, the thermal epoxy is designed to optimize heat dissipation of aerospace,...
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July 6, 2009 —
UV Cure Adhesive Excels in Bond Strength
Hackensack, NJ. June 30, 2009- Master Bond adds a significant strength advantage to a new UV adhesive compound combining high strength bonds with the well established benefits of UV cure namely; high productivity, improved performance and environmental compliance. Master Bond UV10TK40 is a modified epoxy adhesive offering a unique tensile strength of 8300 psi and a shore D hardness greater than 75, forming high surface hardness. It cures tack free in the presence of air and will gel rapidly...
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