June 25, 2008 —
Condensation Cured Silicone Available for Potting and Encapsulation to 400°F
Hackensack, NJ. May 28, 2008-A two part, condensation cured liquid silicone system called Master Sil 150 has been developed by Master Bond, Inc., Hackensack, NJ. It can be used for the potting and encapsulation of voltage regulators, high voltage transformers, as well as optical and electronic assemblies. Master Sil 150 has good thermal stability combined with excellent flexibility. It has a Shore A hardness of 40 and its elongation at break is 230%. Low viscosity ensures complete fill-in...
June 19, 2008 —
Strong "Instant Cure" Adhesive
Hackensack, NJ. May 28, 2008-Master Bond Inc, Hackensack, NJ is pleased to announce the introduction of a high strength "instant cure" cyanoacrylate adhesive called MB297. In addition to high strength bonds as high as 2800 psi in shear, it provides better general resistance to effects of extreme humidity. MB297 is supplied as a viscous liquid adhesive with a viscosity (at 20°C) of 2000-2400 cps. Its appearance is colorless, and the refractive index is 1.48. Its service operating temperature...
June 6, 2008 —
NEW USP Class VI Approved Adhesive is Optically Clear
HACKENSACK, NJ - May 29, 2008 -- A new one component, low viscosity, optically clear, UV curable adhesive called UV10MED has been developed by Master Bond Inc., Hackensack, N.J. This compound is USP Class VI approved and is recommended for use in medical device manufacturing. It offers superior adhesion to metals, glass, ceramics and most plastics. It also has excellent chemical resistance properties and is resistant to many types of sterilants. It has a service operating temperature range of...
May 30, 2008 —
NEW USP Class VI Approved Adhesive is Optically Clear
HACKENSACK, NJ - May 29, 2008 -- A new one component, low viscosity, optically clear, UV curable adhesive called UV10MED has been developed by Master Bond Inc., Hackensack, N.J. This compound is USP Class VI approved and is recommended for use in medical device manufacturing. It offers superior adhesion to metals, glass, ceramics and most plastics. It also has excellent chemical resistance properties and is resistant to many types of sterilants. It has a service operating temperature range of...
May 6, 2008 —
New Epoxy Adhesive Serviceable at Cryogenic Temperatures
HACKENSACK, NJ - May 1, 2008 -- Master Bond Inc., Hackensack, N.J. has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).
May 6, 2008 —
High Strength Epoxy Now Approved for Low Outgassing Applications
Hackensack, NJ. April 29, 2008 - Master Bond Inc has developed a high temperature resistant epoxy resin system called EP121CL for service up to 260°C (500°F). The two component, optically clear, low viscosity epoxy resin system features high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation applications. Especially noteworthy are its mechanical properties of 12,100 psi in tensile...
April 8, 2008 —
Epoxy Has Outstanding Dimensional Stability
Master Bond Inc., Hackensack, N.J. has developed EP21LM-3, a two component, medium viscosity epoxy resin system for high performance bonding, encapsulation and coating. EP21LM-3 readily develops high physical strength properties including a tensile modulus greater than 100,000 psi (690 MPa) and a tensile shear strength greater than 2300 psi (16 MPa). It is easy to apply. Having a viscosity of 37,000 cps the product flows evenly and smoothly without application of pressure, wets surfaces and...
March 31, 2008 —
Epoxy for High Performance Filament Wound Structures Resists up to 500°F
Hackensack, NJ. March 26, 2008, 2008-Master Bond Inc., has developed EP34CA, a polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures and in potting and casting applications. When used in conjunction with select hardeners, EP34CA produces a low viscosity system which is particularly well suited for filament windings of glass, graphite and KevlarŪ fibers and boron composites as well as pultruded structures. Cured composite structures have a high...