| TABLE OF CONTENTS |
| 1. | Summary | 1 |
| 2. | What Is RoHS & WEEE | 1-2 |
| 3. | Identification and Tracking of Pb-Free Components | 2 |
| 4. | Requalification of Components and Assemblies | 2-3 |
| 5. | Repair and Rework | 3 |
| 6. | Recovery and Recycling of Waste Electrical and Electronic Equipment (WEEE) | 3-4 |
| 7. | Solder Pad Finish | 4 |
| 8. | RoHS 2002/95/EC | 4-5 |
| 8.1 | Definition | 4 |
| 8.2 | Objective | 4 |
| 8.3 | Principles | 4 |
| 8.4 | Application | 4-5 |
| 8.5 | RoHS Exceptions | 5 |
| 9. | WEEE 2002/96/EC | 5-7 |
| 9.1 | Definition | 5-6 |
| 9.2 | Objective | 6 |
| 9.3 | Principle | 6 |
| 9.4 | Responsibilities | 6 |
| 10. | RoHS & WEEE Impact on OEMs | 7 |
| 11. | References | 7 |
| 12. | Table - WEEE Recovery Targets | 7 |