| TABLE OF CONTENTS |
|---|
| 1. | Introduction | 1-2 |
| 2. | Polymer Basics | 2-3 |
| 3. | Thermoplastics Die Attach Adhesives | 3 |
| 4. | Processing | 4 |
| 4.1 | Paste Application | 4 |
| 5. | Wafer-Level Die Attach Adhesive | 4 |
| 5.1 | Dry-Film Adhesive Application | 5 |
| 6 | The Bonding Step | 5-7 |
| 7. | Applications | 7-8 |
| 8. | Performance | 8 |
| 9. | Rework | 8-9 |
| 10. | Flip Chip and Underfill | 9 |
| 10.1 | Thermoset Underfills | 9-10 |
| 10.2 | Thermoplastic Underfills | 10-12 |
| 11. | Application Methods | 12 |
| 12. | Rework | 13 |
| 13. | Future Work | 13 |
| 14. | Cost | 13 |
| 14.1 | Die-Attach Costs | 13 |
| 14.2 | Underfill Costs | 13-15 |
| 15. | Conclusions/Summary | 15 |
| 16. | Reference | 15 |
| 17. | Tables | |
| 17.1 | Table 1: Properties of a Range of Thermoplastics Now in Commercial Use | 8 |
| 17.2 | Table 2 | 9 |
| 18. | Figures | |
| 18.1 | Die Attach Film Bonding | 5 |
| 16.2 | Thermoplastic Bonding Window | 6 |
| 18.3 | Time-Temp-Pressure Relationship | 7 |
| 18.4 | Flip Chip Assembly Steps | 10 |
| 18.5 | W-L FC | 11 |
| 18.6 | Reflow Profile | 12 |
| 18.7 | Input for SPACE Software to Calculate QFP Assembly Cost and Profit | 14 |
| 18.8 | Cost Output from SPACE for the QFP Assembly | 14 |
| 18.9 | A Cost Comparison of the QFP and FC Assembly Processes | 15 |
