| TABLE OF CONTENTS |
| 1. | Introduction | 2-3 |
| 2. | Polymer Thick Film Basics | 3-6 |
| 2.1 | Substrate | 4 |
| 2.2 | Inks | 4 |
| 2.3 | Dielectrics | 4 |
| 2.4 | Joining Materials - Conductive Adhesives | 4-5 |
| 2.5 | PTF Processes | 5-6 |
| 3. | Micro Packaging Assembly with Conductive Adhesives | 6-7 |
| 3.1 | TAB (Tape Automated Bonding) | 6 |
| 3.2 | Flip Chip Technology | 6-7 |
| 4. | Application and Case Histories | 7 |
| 4.1 | Blood Oxygen Sensors | 7-8 |
| 4.2 | Stress Sensor | 9 |
| 4.3 | RFID products & Markets | 10 |
| 4.4 | Building RFIDs | 10-11 |
| 4.5 | Isotropic Conductive Adhesive (ICA) Assembly | 11-12 |
| 4.6 | Anisotropic Conductive Adhesive (ICA) Assembly | 12 |
| 5. | Conclusions & Summary | 13 |
| 6. | Figures | |
| 6.1 | PTF Products- PFC | 3 |
| 6.2 | PTF Products- PFC | 3 |
| 6.3 | Flip Chip from IBM | 6 |
| 6.4 | FC on PTF-Flex PVC | 7 |
| 6.5 | Poly-Flex Circuits/Nellcore Corp. | 8 |
| 6.6 | Blood Oxygen Sensor in Use | 8 |
| 6.7 | Stress Sensor | 9 |
| 6.8 | Sensor with Adhesively-Bonded Component | 9 |
| 6.9 | Printed Antenna PFC | 11-12 |
| 6.10 | Polymer Dip Chip | 12 |
| 6.11 | ACA | 13 |