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Conductive Adhesives - The High Tech Solution in Medical Electronics

Publisher: All Flex, Inc.
Overview:
This paper reviews the progress made in PTF technology with a focus on conductive adhesives and their use in medical solutions. It explains the additive method of applying conductors over subtrates in PTF circuits, and attributes the growth of PTF circuits to the rise of SMT. The features and applications of building block materials of PTF technology such as substrate, conductive inks, dielectrics, conductive adhesives, and non-conductive adhesives or encapsulants are outlined along with PTF processes such as fabrication, screen printing, curing, blanking, PTF assembly, and testing. Tape Automated Bonding (TAB) and Flip Chip or Direct Chip Attach package technology used in medical electronics are explained. Application of PTF circuits in blood oxygen sensors, stress sensor, RFID products are described, and the RFID technology is explained. The process of using isotropic and anisotropic conductive adhesive for flip-chip assembly is detailed. Advantages and limitations are also highlighted with case histories used for examples.
TABLE OF CONTENTS
1.Introduction2-3
2.Polymer Thick Film Basics3-6
2.1Substrate4
2.2Inks4
2.3Dielectrics4
2.4Joining Materials - Conductive Adhesives4-5
2.5PTF Processes5-6
3.Micro Packaging Assembly with Conductive Adhesives6-7
3.1TAB (Tape Automated Bonding)6
3.2Flip Chip Technology6-7
4.Application and Case Histories7
4.1Blood Oxygen Sensors7-8
4.2Stress Sensor9
4.3RFID products & Markets10
4.4Building RFIDs10-11
4.5Isotropic Conductive Adhesive (ICA) Assembly11-12
4.6Anisotropic Conductive Adhesive (ICA) Assembly12
5.Conclusions & Summary13
6.Figures
6.1PTF Products- PFC3
6.2PTF Products- PFC3
6.3Flip Chip from IBM6
6.4FC on PTF-Flex PVC7
6.5Poly-Flex Circuits/Nellcore Corp.8
6.6Blood Oxygen Sensor in Use8
6.7Stress Sensor9
6.8Sensor with Adhesively-Bonded Component9
6.9Printed Antenna PFC11-12
6.10Polymer Dip Chip12
6.11ACA13
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