Improvement of Organic Packaging Thermal Cycle Performance Measurement

Publisher: Endicott Interconnect

Format: PDF
Date: 2008-01-18

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Overview:
An evaluation of Deep Thermal Cycle (DTC) and Accelerated Thermal Cycle (ATC) environmental stress testing of Flip Chip Plastic Ball Grid Array (FCPBGA) modules is presented in this paper. It includes an image and cross-sectional diagram of a FCPBGA-HP module, and a table that lists the results of thermal cycling free standing FCPBGA-HP modules with thermal cycle conditions of -55°C to +125°C. An example of crack propagation through the dielectric of a module experiencing DTC environmental testing is illustrated, and the experimental procedure undertaken for analyzing the stress testing methods is described. Results of ATC stress test of FCPBGA-HP modules on test boards with thermal cycle conditions of 0-100°C and DTC stress test of FCPBGA-HP module/interposer assemblies with thermal cycle conditions of -55°C to 100°C are reviewed with the help of tabular data. This report also includes images of the various FCPBGA-HP module/interposer test vehicles and an open clam shell socket test fixture.

TABLE OF CONTENTS
1.	Introduction	1
2.	Experimental Description	3
3.	Results and Discussion	4
4.	Conclusions	5
5.	References	6
6.	Figures
6.1.	Figure 1. FCPBGA-HP Module without Lid from Top View and Bottom View	2
6.2.	Figure 2. Cross-Sectional Diagram of the FCPBGA-HP Module (Not to Scale)	2
6.3.	Figure 3. Example of Crack Propagation through the Dielectric of a Module Experiencing DTC Environmental Stressing	2
6.4.	Figure 4. Example of Crack Propagation through the Dielectric of a Module and Circuit Line Experiencing DTC Environmental Stressing	3
6.5.	Figure 5. Cross-Sectional Diagram View of the Module Mounted on the Interposer (Not to Scale)	3
6.6.	Figure 6. 52.5mm FCPBGA-HP Module / Interposer Assembly Test vehicle	4
6.7.	Figure 7. Open Clam Shell Socket Test Fixture	4
6.8.	Figure 8. 52.5 mm FCPBGA-HP Module / Interposer Assembly Test Vehicle in the Open Clam Shell Socket Test Fixture	4
6.9.	Figure 9. 52.5 mm FCPBGA-HP Module / Interposer Assembly Test Vehicle in the Closed Clam Shell Socket Test Fixture	4
7.	Tables
7.1.	Table 1: Results of Thermal Cycling Free Standing FCPBGA-HP Modules	2
7.2.	Table 2: Process Flow for Module Preconditioning, Interposer Attachment, and Module Environmental Stress Testing	3
7.3.	Table 3: Results of Thermal Cycling of FCPBGA-HP Module on Test Boards	5
7.4.	Table 4: Results of Thermal Cycle Testing of FCPBGA-HP Module / Interposer Assemblies	5