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Forces Driving Change in Tape and Hot Melt Adhesive Dispensing Technologies

Publisher: Nordson Corp.

Format: PDF
Date: 2008-11-18

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Nordson Corp.
White Papers

Overview:
The driving forces in tape and hot melt adhesive dispensing technologies, and the ongoing trend toward low-maintenance systems evolving advanced hot melt adhesives applied by simple machines, are covered in this white paper. Highlights of how the technologies have evolved from the 1980s until now, and suggestions about future designs for sealing technologies are presented. This study of tape and hot melt sealing technology focuses on the 10 to 30 cpm packaging arena and provides objective data useful in making purchasing decisions now and in the future. The adoption of microprocessor controls in the 1980s reduced hot melt maintenance by automating daily operating functions, and the reasons behind the development shifts toward low-maintenance hot melt adhesives and machines during 1990s, are discussed. Tables and Figures describing break-even point between tape and hot melt costs are also presented.

TABLE OF CONTENTS
1.	Introduction	1
2.	1980s: Microprocessors & Antioxidants	2
3.	1990s: Development Shifts toward Low-Maintenance Hot Melt Adhesives and Machines	3
4.	Sealing Today	5
5.	Eliminating Repetitive Maintenance	5
6.	Conclusion	9
7.	References	10
8.	Appendix	11
8.1.	Dispensing Adhesive Using Hot Melt Technology	11
8.2.	Nordson Technology Timeline	12
9.	Figures
9.1.	Manufacturing Components of Tape vs. Hot Melt	6
9.2.	Break-even Point between Tape and Hot Melt Costs	7
9.3.	Getting Tape Adhesive onto the Box	8
9.4.	Getting Hot Melt Adhesive onto the Box	8
10.	Tables
10.1.	Cost Components:Tape vs. Hot Melt Adhesive	7