| TABLE OF CONTENTS |
| 1. | Introduction | 2 |
| 2. | References | 3 |
| 3. | Definitions | 4 |
| 3.1. | Bathtub Curve | 4 |
| 3.2. | Burn-In Test | 4 |
| 3.3. | Creep | 4 |
| 3.4. | Coffin-Manson Model | 4 |
| 3.5. | Corrective Action | 4 |
| 3.6. | Cyclic Differential Expansion | 4 |
| 3.7. | Cyclic Temperature Range or Swing | 4 |
| 3.8. | Destruct Limit | 4 |
| 3.9. | Detection Screen | 4 |
| 3.10. | Environmental Stress Screening | 4 |
| 3.11. | Highly Accelerated Stress Screen | 4 |
| 3.12. | Infant Mortality | 5 |
| 3.13. | Latent | 5 |
| 3.14. | Maximum Cyclic Strain Range | 5 |
| 3.15. | NAVMAT P-9492 Random Vibration Profile | 5 |
| 3.16. | Operating Limit | 5 |
| 3.17. | Patent | 5 |
| 3.18. | Precipitate | 5 |
| 3.19. | Precipitation Screen | 5 |
| 3.20. | Proof of Screen | 5 |
| 3.21. | Random Vibration | 5 |
| 3.22. | Sine Vibration | 5 |
| 3.23. | Solder Attachment | 5 |
| 3.24. | Step Stress Approach | 5 |
| 3.25. | Stress Relation | 5 |
| 3.26. | Thermal Cycling | 6 |
| 3.27. | Thermal Shock | 6 |
| 3.28. | Vibration | 6 |
| 4. | Background | 7 |
| 5. | Solder Joint Failure Mechanisms and Environmental Stimuli | 12 |
| 6. | Introduction of Mathematical Models | 14 |
| 6.1. | The Arrhenius Reaction Rate Model | 14 |
| 6.2. | The RADC Models | 15 |
| 6.2.1. | The RADC Constant Temperature Model | 15 |
| 6.2.2. | The RADC Thermal Cycling Model | 16 |
| 7. | Product Profiling | 19 |
| 7.1. | Documentation | 19 |
| 7.2. | Selection of Stimuli | 19 |
| 7.3. | Determination of Product Limits | 20 |
| 7.4. | Product Changes to Improve Margins | 20 |
| 8. | Screen Development | 21 |
| 8.1. | Selection of Stimuli | 21 |
| 8.2. | Magnitude of Precipitation Stimuli | 21 |
| 8.2.1. | Voltage | 22 |
| 8.2.2. | Vibration | 22 |
| 8.2.3. | Thermal Cycling | 22 |
| 8.2.4. | Power Cycling | 22 |
| 8.3. | Duration of Applied Stimuli | 22 |
| 8.4. | Proof of Screen | 23 |
| 8.5. | Testing During the Precipitation Screen | 24 |
| 8.6. | Detection Screens | 24 |
| 8.6.1. | Voltage | 24 |
| 8.6.2. | Vibration | 24 |
| 8.6.3. | Thermal Cycling | 24 |
| 8.6.4. | Elevated Temperature | 25 |
| 8.7. | Root Cause Analysis | 25 |
| 8.8. | Optimizing the ESS Process | 25 |
| 8.9. | Corrective Action | 26 |
| 8.10. | Re-Screening Product | 27 |
| 9. | Thermal Screening Equipment | 28 |
| 10. | Conclusions | 30 |
| 11. | Figures | 8 |
| 11.1. | IES Survey of Screening Effectiveness | 8 |
| 11.2. | French ESS Task Team ESS Effectiveness Survey | 9 |
| 11.3. | Stress Strain Curves for Solder Joints | 12 |
| 11.4. | Solder Joint Lifetime as a Function of Thermal Cycling Temperature Range | 13 |
| 11.5. | Arrhenuis Acceleration Plot as Function of Temperature | 15 |
| 11.6. | RADC Model for Screening Strength of Constant Temperature Screen | 16 |
| 11.7. | Screening Strength as a Function of Number of Thermal Cycles | 17 |
| 11.8. | Number of Thermal Cycles as a Function of Rate of Temperature Change | 17 |
| 11.9. | Screening Strength as a Function of Time | 18 |
| 11.10. | Single Zone Chamber Layout | 29 |
| 11.11. | 2 Zone Air-to-Air Chamber | 29 |
| 12. | Tables | 8 |
| 12.1. | Summary of Electrical Burn-in Results | 8 |
| 12.2. | Baseline Regimen for Organizations Lacking ESS Experience | 9 |
| 12.3. | IC Failure Mechanism and the Best Screens for Precipitation or Detection | 11 |
| 12.4. | Screening Time and Temperature Rate of Change | 18 |