Adhesives & Sealants White Papers

Isocyanate and Polyol Essentials for Your Reactive Hotmelt Adhesives
Description: The advantages of combining thermoset adhesives with conventional hot melts for achieving high initial strength, low VOC emissions, and good long-term adhesive properties are presented in this paper along with compounding guidelines for reactive... More
Publisher: Bayer MaterialScience, LLC
Release Date: 2007-09-29

High-Performance Elastomeric Polyurethane Sealants for Mall of America Construction Project
Description: This paper covers the properties of the two-component, self leveling polyurethane sealant applied to the concrete joints in the parking ramps of the Mall of America, and highlights the advantages of elastomeric polyurethane sealants over silicon... More
Publisher: Bayer Corp.
Release Date: 2007-09-26

Army Hospital Maintains Firestop Integrity
Description: This white paper details the construction of Madigan Medical Complex in conformity with the latest life safety standards including automatic sprinklers and compartmentalized fire rated construction. It details a brief description about the... More
Publisher: 3M Specialty Materials Div.
Release Date: 2007-03-13

AT&T Stresses Fire Protection Standards at the University of Maryland
Description: This white paper explains how AT&T executed the installation of fire protection material as specified in the university documentation of the construction project at the University of Maryland. It lists the firestop products, their properties and... More
Publisher: 3M Specialty Materials Div.
Release Date: 2007-03-13

Building Code Requirements for Fireblocks
Description: Fireblocking is the remedial measure for the spread of fire, and involves the use of field-installed building materials to prevent the movement of undetected flames and gases to other areas. This paper presents building code requirements for... More
Publisher: 3M Specialty Materials Div.
Release Date: 2007-03-13

Effects of Tg and CTE on Semiconductor Encapsulants
Description: Many factors influence component reliability. The determinants that impact performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. A summary of the common practices... More
Publisher: Henkel Loctite Corporation
Release Date: 2007-03-13

Epoxies Used in Tensile Testing: Film vs. Liquid-Why is There a Difference?
Description: Tensile testing of thermal spray coatings is currently covered by a variety of internal company specifications and generally by ASTM C-633. This document reviews the comparision of tensile testing using film and liquid epoxies and analyses how... More
Publisher: IMR Test Labs
Release Date: 2007-03-13

Fibre Optic Installation Features Latest Fire Stopping Procedures
Description: Effective sealing and complaince with the latest fire protection standards in materials, methods and inspection are vital for the safety of the occupants of a building as well as the sensitive electronic equipment installed in it. This white paper... More
Publisher: 3M Specialty Materials Div.
Release Date: 2007-03-13

Flux Chemistries and Thermal Profiling: Avoiding Soldering Defects in SMT Assembly
Description: This paper highlights the importance of thermal profiling as a part of paste chemistry application that leads to reliable solder jointing if properly administered. It describes no-clean, water washable, and rosin-based pastes, along with their... More
Publisher: Henkel Loctite Corporation
Release Date: 2007-03-13

Patterned Conductive Adhesives to Replace Soldering for Connecting Flex Circuit Films
Description: This paper describes a new type of Z-axis conductive epoxy adhesive, known as area bonding conductive epoxy adhesive (ABC), to replace soldering for connecting flexible circuit films to LTCC, FR-4, or other substrates. The development of ABC... More
Publisher: TechFilm Corporation
Release Date: 2007-03-13