Adhesives & Sealants White Papers

Effects of Tg and CTE on Semiconductor Encapsulants
Description: Many factors influence component reliability. The determinants that impact performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. A summary of the common practices... More
Publisher: Loctite Industrial, Henkel Corp.
Release Date: 2007-03-13

Epoxies Used in Tensile Testing: Film vs. Liquid-Why is There a Difference?
Description: Tensile testing of thermal spray coatings is currently covered by a variety of internal company specifications and generally by ASTM C-633. This document reviews the comparision of tensile testing using film and liquid epoxies and analyses how... More
Publisher: IMR Test Labs
Release Date: 2007-03-13

Fibre Optic Installation Features Latest Fire Stopping Procedures
Description: Effective sealing and complaince with the latest fire protection standards in materials, methods and inspection are vital for the safety of the occupants of a building as well as the sensitive electronic equipment installed in it. This white paper... More
Publisher: 3M Specialty Materials Div.
Release Date: 2007-03-13

Flux Chemistries and Thermal Profiling: Avoiding Soldering Defects in SMT Assembly
Description: This paper highlights the importance of thermal profiling as a part of paste chemistry application that leads to reliable solder jointing if properly administered. It describes no-clean, water washable, and rosin-based pastes, along with their... More
Publisher: Loctite Industrial, Henkel Corp.
Release Date: 2007-03-13

Tensile Bond Strength Variance of Thermally Sprayed Coatings with Respect to Adhesive Type
Description: Tensile bond strength variance of thermally sprayed coatings with respect to adhesive type is the focus of this white paper. It provides a detailed description of a program conducted to assess the metallographic and testing capabilities of various... More
Publisher: IMR Test Labs
Release Date: 2007-03-13

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections
Description: Focusing on package level fabrication and integration, this paper analyzes the performance reliability of micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis... More
Publisher: Endicott Interconnect Technologies, Inc.
Release Date: 2007-01-01

Solder Paste Evaluation Techniques to Simplify the Transition to PB-Free
Description: This paper presents practical recommendations and techniques for evaluating Pb-free solder pastes to ensure that the selected solder paste delivers better assembly yields than the incumbent Sn/Pb solder paste. The importance of considering proper... More
Publisher: Indium Corporation
Release Date: 2006-12-08

Solvent Resistance of Silicones Used for Electronic Packaging Applications
Description: This paper evaluates the solvent resistance of silicone materials that can be used for electronic packaging and explores how silicones can be used as an encapsulant, interface material, and/or as an adhesive for microelectronic applications.... More
Publisher: NuSil Technology LLC
Release Date: 2006-11-28

Overcoming Package Stress in Flip Chips with Low Outgassed Silicone Materials to Reduce Contamination
Description: Applicability of low outgased CV (Controlled Volatility) grade silicones to electronic packaging in flip chip assembly is examined in this paper. Benefits of using silicones as thermal interface material (TIMS) and underfills in flip chip assemblies... More
Publisher: NuSil Technology LLC
Release Date: 2006-07-31

Comparing Silicone Pressure-Sensitive Adhesives to Silicone Gels for Transdermal Drug Delivery
Description: The differences in applications of silicone pressure sensitive adhesives and silicone gels for transdermal drug delivery are investigated in this paper. Transdermal drug-delivery applications mandate the use of adequate adhesive systems to not only... More
Publisher: NuSil Technology LLC
Release Date: 2006-07-26