Adhesives & Sealants White Papers

Tensile Bond Strength Variance of Thermally Sprayed Coatings with Respect to Adhesive Type
Description: Tensile bond strength variance of thermally sprayed coatings with respect to adhesive type is the focus of this white paper. It provides a detailed description of a program conducted to assess the metallographic and testing capabilities of various... More
Publisher: IMR Test Labs
Release Date: 2007-03-13

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections
Description: Focusing on package level fabrication and integration, this paper analyzes the performance reliability of micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis... More
Publisher: Endicott Interconnect
Release Date: 2007-01-01

Solder Paste Evaluation Techniques to Simplify the Transition to PB-Free
Description: This paper presents practical recommendations and techniques for evaluating Pb-free solder pastes to ensure that the selected solder paste delivers better assembly yields than the incumbent Sn/Pb solder paste. The importance of considering proper... More
Publisher: Indium Corporation of America
Release Date: 2006-12-08

Solvent Resistance of Silicones Used for Electronic Packaging Applications
Description: This paper evaluates the solvent resistance of silicone materials that can be used for electronic packaging and explores how silicones can be used as an encapsulant, interface material, and/or as an adhesive for microelectronic applications.... More
Publisher: NuSil Technology
Release Date: 2006-11-28

Overcoming Package Stress in Flip Chips with Low Outgassed Silicone Materials to Reduce Contamination
Description: Applicability of low outgased CV (Controlled Volatility) grade silicones to electronic packaging in flip chip assembly is examined in this paper. Benefits of using silicones as thermal interface material (TIMS) and underfills in flip chip assemblies... More
Publisher: NuSil Technology
Release Date: 2006-07-31

Comparing Silicone Pressure-Sensitive Adhesives to Silicone Gels for Transdermal Drug Delivery
Description: The differences in applications of silicone pressure sensitive adhesives and silicone gels for transdermal drug delivery are investigated in this paper. Transdermal drug-delivery applications mandate the use of adequate adhesive systems to not only... More
Publisher: NuSil Technology
Release Date: 2006-07-26

New Low Stress Film Adhesive for Aerospace Applications Requiring Low Outgassing
Description: This paper examines the future applications of low stress liquid adhesives based on silicone chemistry for aerospace industry requiring low outgassing, by characterizing new film adhesives and comparing them with similar liquid materials. Definition... More
Publisher: NuSil Technology
Release Date: 2006-05-01

Alternatives in Gearbox Seals for Main Drive Gearboxes
Description: Labyrinth Seal is one of the many devices used to seal Marine Reduction Gears. While the seal has been successful in some applications, it has not performed satisfactorily in others. This paper attempts to understand the use of mechanical seals as... More
Publisher: Stein Seal Co.
Release Date: 2006-01-02

Low Outgassing Materials for Electro-Optic and Electronic Systems
Description: The need for low outgassing, thermally stable, and high performance materials for electro-optic and electronic systems is explored in this paper. Various applications of low outgassing materials in electro-optic and electronic systems are mentioned.... More
Publisher: NuSil Technology
Release Date: 2005-03-18

Drug Delivery Market Summary
Description: Applications of off-the-shelf silicones offered by NuSil Technology in drug delivery systems are described in this paper. An overview of implanted delivery devices, mucosal delivery devices, and transdermal delivery devices, which incorporate... More
Publisher: NuSil Technology
Release Date: 2004-06-25