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Automation & Electronics White PapersDisplaying 1 to 10 of 109 results
Improvement of Organic Packaging Thermal Cycle Performance Measurement
Description: An evaluation of Deep Thermal Cycle (DTC) and Accelerated Thermal Cycle (ATC) environmental stress testing of Flip Chip Plastic Ball Grid Array (FCPBGA) modules is presented in this paper. It includes an image and cross-sectional diagram of a... More Publisher: Endicott Interconnect Release Date: 2008-01-18
Manufacture and Characterization of a Novel Flip-Chip Package Z-Interconnect Stack-up with RF Structures
Description: Emphasizing on the need for multi-GHz RF structures for multi chip packages to meet their performance targets, this paper demonstrates a new flip-chip package test vehicle (TV) that uses Z-axis interconnection (z-interconnect) building blocks to... More Publisher: Endicott Interconnect Release Date: 2008-01-18
Modeling and Simulation of 12.5 Gb/s on a HyperBGA® Package
Description: Demonstrating that current HyperBGA® technology meets the performance requirements for applications running at speeds of 12.5 Gbps per channel, this paper presents high-speed/high-frequency modeling and simulation results for company's HyperBGA®... More Publisher: Endicott Interconnect Release Date: 2008-01-18
Design, Fabrication, and Reliability Assessment of Embedded Resistors and Capacitors on Multilayered Organic Substrates
Description: An entire process from design and fabrication to electrical characterization and reliability testing of embedded passives on multilayered microvia organic substrate is presented in this paper. Scope and application of embedded passives technology in... More Publisher: Endicott Interconnect Release Date: 2008-01-17
Large Thin Organic PTFE Substrates for Multichip Applications
Description: The adaptation of PTFE laminate usage from single chip package format towards multiple chip format to enable high performance SIP applications is described in this paper. It includes an illustration of a multi chip format application utilizing PTFE... More Publisher: Endicott Interconnect Release Date: 2008-01-09
Thermal Enhancement of Systems Using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
Description: This paper reviews the thermal performance characteristics of organic flip chip packages (FC-PBGA) incorporating thin (0.5 mm), high interconnect density (dense-core) organic substrates using 1-D calculations and 3-D numerical analysis. It reports... More Publisher: Endicott Interconnect Release Date: 2008-01-09
Thermal Performance of a High End Flip-Chip Organic Package
Description: This white paper provides a numerical study of the thermal performance of HyperBGA® high end flip-chip organic package. Material, structure, and design aspects of the HyperBGA organic chip packaging technology are reviewed. Package and geometry... More Publisher: Endicott Interconnect Release Date: 2008-01-09
Thermal Performance of a Thin High Interconnect Density Organic Substrate for Flip-Chip Applications
Description: The main focus of this study is on the thermal performance of a thin (0.5 mm), high interconnect density substrate for flip chip applications conducted under natural and forced convection conditions. The paper reviews thermal performance... More Publisher: Endicott Interconnect Release Date: 2008-01-09
21 CFR Part 11: Electronic Signature Requirements
Description: Functionality offered by ASI DataMyte's Applied Stats SPC software package that incorporates a robust set of security options and policies that allow customers to comply with the 21 CFR Part 11 regulation for collecting quality data is described in... More Publisher: ASI Datamyte Release Date: 2008-01-03
Implementation of IEC 61196-1 Shielded Screening Attenuation Test Method
Description: Physical design and electrical characteristics of coaxial cable screening attenuation test fixtures which meet the guidelines of IEC 61196-1 are reviewed in this paper. An illustration of the text fixture design is provided and the regions of the... More Publisher: Belden Electronics Div. Release Date: 2007-12-21 |
