Materials Handling White Papers

PACLINE Overhead Conveyors Case Study: Powered Over/Under Conveyor Improves Safety and Conserves Floor Space
Description: This case study presents details about the new assembly conveyor system installed by Pacline Overhead Conveyors at Cardwell Westinghouse's facility where their 2300 DJ self adjusting slack adjuster is produced and assembled. It highlights how... More
Publisher: Pacline Overhead Conveyors
Release Date: 2008-09-09

Paint Line Automation for the Small Wood Shop
Description: This paper details how the low cost paint line conveyors can benefit small shop owners by presenting a case study about the conveyor systems provided by PACLINE for Contract Supply Inc., a manufacturer of chairs and tables primarily for the... More
Publisher: Pacline Overhead Conveyors
Release Date: 2008-09-01

Save $91,000 Annually in Low Pressure Boiler Water Treatment Chemical and Fuel Costs Using a Dealkalizer
Description: This white paper demonstrates how dealkalization of boiler feed water improves boiler steam/condensate systems reliability, and highlights the fuel and chemical savings that can be realized. It provides an overview of the operating expenses for low... More
Publisher: Res-Kem Corp.
Release Date: 2008-02-11

Improvement of Organic Packaging Thermal Cycle Performance Measurement
Description: An evaluation of Deep Thermal Cycle (DTC) and Accelerated Thermal Cycle (ATC) environmental stress testing of Flip Chip Plastic Ball Grid Array (FCPBGA) modules is presented in this paper. It includes an image and cross-sectional diagram of a... More
Publisher: Endicott Interconnect
Release Date: 2008-01-18

Manufacture and Characterization of a Novel Flip-Chip Package Z-Interconnect Stack-up with RF Structures
Description: Emphasizing on the need for multi-GHz RF structures for multi chip packages to meet their performance targets, this paper demonstrates a new flip-chip package test vehicle (TV) that uses Z-axis interconnection (z-interconnect) building blocks to... More
Publisher: Endicott Interconnect
Release Date: 2008-01-18

Modeling and Simulation of 12.5 Gb/s on a HyperBGA® Package
Description: Demonstrating that current HyperBGA® technology meets the performance requirements for applications running at speeds of 12.5 Gbps per channel, this paper presents high-speed/high-frequency modeling and simulation results for company's HyperBGA®... More
Publisher: Endicott Interconnect
Release Date: 2008-01-18

Thermal Enhancement of Systems Using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
Description: This paper reviews the thermal performance characteristics of organic flip chip packages (FC-PBGA) incorporating thin (0.5 mm), high interconnect density (dense-core) organic substrates using 1-D calculations and 3-D numerical analysis. It reports... More
Publisher: Endicott Interconnect
Release Date: 2008-01-09

Thermal Performance of a High End Flip-Chip Organic Package
Description: This white paper provides a numerical study of the thermal performance of HyperBGA® high end flip-chip organic package. Material, structure, and design aspects of the HyperBGA organic chip packaging technology are reviewed. Package and geometry... More
Publisher: Endicott Interconnect
Release Date: 2008-01-09

Thermal Performance of a Thin High Interconnect Density Organic Substrate for Flip-Chip Applications
Description: The main focus of this study is on the thermal performance of a thin (0.5 mm), high interconnect density substrate for flip chip applications conducted under natural and forced convection conditions. The paper reviews thermal performance... More
Publisher: Endicott Interconnect
Release Date: 2008-01-09

Applied Stats, Checkweighers and Net Weight Control
Description: Benefits of interfacing ASI DataMyte Applied Stats software with a checkweigher for performing data collection and eliminating compliance issues related to products falling below the designated maximum allowable variance (MAV) limit are presented in... More
Publisher: ASI Datamyte
Release Date: 2008-01-03