Materials Handling White Papers

Flip Chip Assembly Challenges Using High Density, Thin Core Carriers
Description: Learning and conclusions related to flip chip assembly of CoreEASEI dense core technology are summarized in this paper, which focuses on the impact of carrier attributes on carrier level flatness, the impact of underfill attributes on post underfill... More
Publisher: Endicott Interconnect
Release Date: 2005-01-01

MEMS Packaging Update
Description: The main focus of this paper is on the packaging requirements for Microelectromechanical Systems (MEMS). Besides mentioning the packaging challenges of MEMS inertial devices, the article also highlights the importance of cavity style packaging,... More
Publisher: All Flex, Inc.
Release Date: 2005-01-01

Durability Testing of Barrier Treated High-Density Polyethylene Small Off-Road Engine Fuel Tanks
Description: Durability testing of barrier treated high-density polyethylene small off-road engine fuel tanks is covered in this report. An overview of test results conducted by California Air Resources Board (CARB) in 2002 for abrasive effects of fuel slosh on... More
Publisher: Fluoro-Seal, Ltd.
Release Date: 2003-03-27

Thin Material Transport Capability
Description: Thin material transport (TMT) conveyor, capable of transporting thin and flexible panels reliably without the use of leaders, and with no damage or impressions in the copper foil is described in this white paper. It includes a detailed description... More
Publisher: Chemcut Corp.
Release Date: 2002-10-14

Auto Giant Seeks Tough, Flexible Flow Track That Performs.
Description: This case study describes the benefits and features of Span-Track gravity flow track manufactured by Unex, which was tested and installed at BMW's manufacturing facility at Greer, South Carolina. Carton flow requirements at the BMW assembly plant... More
Publisher: Unex Manufacturing, Inc.
Release Date: 2000-01-01