ISO 9001:2008 certified. Printed circuit board assembly of low to medium volume, high complexity & high reliability assemblies compliant with a wide range of standards including IPC 610 Class 2 & Class 3. Markets include defense & aerospace, medical, communications, & industrial controls. PCB assembly capabilities include rosin, no clean & aqueous flux chemistries, RoHs & lead only, three high speed Juki lines, 0201 SMT placement with micro BGA to .025 mil spacing, automated SMT print inspection, 7 zone reflow oven with 3 cool down zones (for heavier RF substrates), BGA X-ray & rework, multiple through-hole assembly areas, automated optical inspection, conformal coat, bonding & underfill, potting, ICT & functional test, box build. Quality control: compliance test failures, system failure analysis, component failure analysis. RoHs compliant.
Small Business Enterprise (SBE)
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