Manufacturer's representative of single-layer, double-sided, multilayer, rigid-flex, flex, metal core, HDI, prototype, aluminum/copper core and high temperature printed circuit boards. FR-4 (130/210 Tg), PTFE, polyimide, Kapton®, epoxy and other materials used. Technologies include ball grid array (BGA-surface mount packaging), flip chip device, microvia, blind and buried via, controlled impedance, flat pad design and conductive and non-conductive fill. Engineering, designing, inspection, and RoHS consulting services offered. Serves the aerospace, automotive, computer, consumer electronics, wireless communication, military, medical and manufacturing industries. UL listed. On-time delivery.
ANSI/ESD S20.20-2007
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